SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Signal Relays Up to 2 Amps are an electromechanical device which turns a large load on or off through the use of a smaller control signal. The contacts on these devices have a rating of 10mA, 50mA, 200mA, 250mA, 400mA, 500mA, 1A, 1.25A, and 2A.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() IM01TS $2.66 | TE Connectivity Potter & Brumfield Relays | RELAY TELECOM DPDT 2A 3V | Tube | Through Hole | IM, AXICOM | -40°C ~ 85°C | |
![]() IM02GR $3.74 | TE Connectivity Potter & Brumfield Relays | RELAY TELECOM DPDT 2A 4.5V | Tape & Reel (TR),Tape & Reel (TR),Cut Tape (CT) | Surface Mount | IM, AXICOM | -40°C ~ 85°C | |
![]() IM02JR $2.71 | TE Connectivity Potter & Brumfield Relays | RELAY TELECOM DPDT 2A 4.5V | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | IM, AXICOM | -40°C ~ 85°C | |
![]() IM02KS $1.94 | TE Connectivity Potter & Brumfield Relays | IM02KS=IM RELAY 140MW 4.5V SHORT | Tube | - | * | - | |
![]() IM02SR $2.89 | TE Connectivity Potter & Brumfield Relays | IM02SR=IM RELAY 140MW 4.5V SHORT | Tape & Reel (TR) | - | * | - | |
![]() IM02TS $3.74 | TE Connectivity Potter & Brumfield Relays | RELAY TELECOM DPDT 2A 4.5V | Tube | Through Hole | IM, AXICOM | -40°C ~ 85°C | |
![]() IM03CGR $1.80 | TE Connectivity | RELAY TELECOM DPDT 2A 5V | Tape & Reel (TR) | Surface Mount | IM, AXICOM | -40°C ~ 85°C | |
![]() IM03CTS $2.62 | TE Connectivity Potter & Brumfield Relays | IM03CTS=IM RELAY 140MW 5V HDV | Tube | - | * | - |

A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More