SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Signal Relays Up to 2 Amps are an electromechanical device which turns a large load on or off through the use of a smaller control signal. The contacts on these devices have a rating of 10mA, 50mA, 200mA, 250mA, 400mA, 500mA, 1A, 1.25A, and 2A.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() JMGAPD-26M $81.51 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 1A 26.5V | Bulk | Through Hole | MGA, CII | -65°C ~ 125°C | |
![]() JMGAPD-26P $75.34 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 1A 26.5V | Bulk | Through Hole | MGAD, CII | -65°C ~ 125°C | |
![]() JMGAPD-5L $61.15 | TE Connectivity Aerospace, Defense and Marine | RELAY GENERAL PURPOSE DPDT 1A 5V | Bulk | Through Hole | MGAD, CII | -65°C ~ 125°C | |
![]() JMGAPD-5P $75.34 | TE Connectivity Aerospace, Defense and Marine | RELAY GENERAL PURPOSE DPDT 1A 5V | Bulk | Through Hole | MGAD, CII | -65°C ~ 125°C | |
![]() JMGAPDD-12M $74.73 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 1A 12V | Bulk | Through Hole | MGADD, CII | -65°C ~ 125°C | |
![]() JMGAPDD-18M $69.49 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 1A 18V | Bulk | Through Hole | MGADD, CII | -65°C ~ 125°C | |
![]() JMGAPDD-18P $84.62 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 1A 18V | Bulk | Through Hole | MGADD, CII | -65°C ~ 125°C | |
![]() JMGAT-12MW $99.25 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 1A 12V | Bulk | Through Hole | MGAT, CII | -65°C ~ 125°C |

Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More