SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products not currently assigned to a family class are temporarily assigned to unclassified products in the uncategorized category.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| TE Connectivity Erni | CONN RECEPT 200POS 2MM PRESS-FIT | Bulk | * | ||||
| TE Connectivity AMP Connectors | CONNECTOR | Bulk | * | ||||
![]() 1241390-2 $0.24 | TE Connectivity AMP Connectors | MCP2.8 BU-KONTAKT | Bulk | * | |||
![]() 1241434-2 $10.01 | TE Connectivity AMP Connectors | MOD2ST/FLA-ST108+13 | Bulk | * | |||
![]() 1241634-2 $0.13 | TE Connectivity AMP Connectors | MQS BU-GEH 4P,SW | Bulk | * | |||
![]() 1241637-3 $3.09 | TE Connectivity AMP Connectors | 6POS MQS .63 HEADER 90DEG | Bulk | * | |||
![]() 1241680-1 $0.53 | TE Connectivity AMP Connectors | MODU IV REC.HSG 4POS | Box | * | |||
![]() 1241782-1 $2.01 | TE Connectivity AMP Connectors | 8POS HYBRID MQS .63 HEADER 180DE | Tray | * |

PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More