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Products in this family are interconnect products used in conjunction with Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) materials, and are predominantly of the sort which perform a cable-to-board interconnect function, being mounted to a printed circuit board, and providing both electrical connection and mechanical retention for an inserted FFC or FPC cable.
68611814122View Product
FH12-36S-0.5SH(52)View Product
HFW9R-1STAE1LFView Product
527932070View Product
39532145View Product
TF31-32S-0.5SH(895)View Product
781191620View Product
FH19C-10S-0.5SH(99)View Product
PCA-7F-25-HL-3-GView Product
FB10S027JA2R6000View Product
046823610000846+View Product
ZF1-07-02-T-WT-TRView Product
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
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Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
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Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
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In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
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Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
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In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
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Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
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As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
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Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
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Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
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See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
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