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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in the image sensor and camera family are component or module-level devices used to electronically capture visual information in the visible and/or infrared spectrums. Consisting of an array of photosensitive elements connected to a shared control and interface mechanism, available products include those adapted to common still image and video capture as well as more specialized applications such as thermal and spatial imaging.
AR0820ATSP00XMEA0-TPBMView Product
3889C002View Product
AR0330CM1C00SHKA0-CPView Product
AR0135AT2M25XUEA0-DRBRView Product
NOIX2SE9400B-LTIView Product
461J1650View Product
AR0145CSSM00SMKA0-CP2View Product
AR0147ATSC00XUEA5-DRBRView Product
KAI-11002-ABA-CP-B1View Product
NOIX1SF012KB-LTI1View Product
LI-USB30-VENUS-ISX021-GMSL2-118HView Product
L-012-0058-02View Product
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
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Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
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The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
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STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
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Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
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Understand tactile switches, PCB and keyboard differences, four-pin wiring, debounce, force, travel and replacement checks for reliable control inputs.
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
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Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
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Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
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Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
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An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
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