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PC card sockets are connectors designed to receive card type memory such as CFast, SIM, PCMCIA, Compact Flash, CardBus, ExpressCard, and SD, allowing for regular removal and insertion via hinged lid, push-pull and auto eject methods. They are available in surface, board, screw, straddle, snap-in, and edge mount as well as free-hanging and hand gripped versions.
CFT-125-01-SM-D-RA-01-SLView Product
DM3C-SF(16)View Product
5146027-1View Product
MI20A-50PDR-SF(71)View Product
146029-1View Product
305610000006000+View Product
MSCCP-A1-06-SG-SW-T/RView Product
115H-BA00View Product
5031820852View Product
5558666-1View Product
IC11S-BD-PNEJR(71)View Product
7312E0225S01LFView Product
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
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Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
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An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
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TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
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Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
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Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
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TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
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On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
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Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
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Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
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