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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in the modular embedded processor family integrate a microcontroller, microprocessor, digital signal processor, FPGA, or other such computational device together with support components such as memory, power management, timing, and other items necessary for their operation. They are suitable and intended for integration into an end product, and offer product developers access to modern computational and interface capabilities without necessity of high speed hardware design experience.
B13500-DIM-001-0001View Product
TE0722-02IView Product
TE0600-02BView Product
IW-G30M-C7EV-4E004G-E008G-BEAView Product
FORLINX-OK7110-C+152GSE32GCE11C11View Product
TE0720-04-62I33MAView Product
ME-XU1-9EG-3E-D12E-R4.2View Product
TE0715-04-30-1I3View Product
DC-ME-Y402-S-BView Product
SM-K24-XCL2GCView Product
20-101-1132View Product
DC-ME-Y413-S-BView Product
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
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Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
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Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
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Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
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On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
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