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— IC芯片 | 连接器 | 传感器 | 被动器件 —
RF Power Dividers/Splitters are designed to break an input signal into two or more output signals with a specific phase and amplitude. The insertion loss ranges from 0.1 dB to 6 dB with a frequency range of 0 Hz to 45 GHz.
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
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In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
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Recently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
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In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
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Learn what data acquisition means, from sensors and conditioning to sampling and storage. Review channel timing, wiring, calibration and data quality.
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Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
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Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
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On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
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Choose an ADC converter by resolution, sample rate, noise and input design. Review practical tradeoffs and prepare component requirements for ChipApex.
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Choose a vibration sensor for machine monitoring. Compare sensing methods, bandwidth, noise and mounting, then define the signal-chain requirements.
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If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
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Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
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