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Card edge or edgeboard connectors are a style of connector system in which (typically) a pattern of exposed copper regions at the periphery of a printed circuit board constitutes one-half of a mating connector pair. A common use case being the connection of accessory cards such as graphics accelerators to computer motherboards in desktop PC applications, they offer a relatively low-cost, high density interconnect option for applications where durability is not a primary concern.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 305-030-556-512 $8.89 | EDAC Inc. | CONN EDGE DUAL FMALE 30POS 0.156 | Bulk | Board Edge, Straddle Mount | 305 | -40°C ~ 105°C | |
![]() 305-030-556-558 $10.21 | EDAC Inc. | CONN EDGE DUAL FMALE 30POS 0.156 | Box | Board Edge, Straddle Mount | 305 | -40°C ~ 105°C | |
![]() 305-030-556-568 $10.21 | EDAC Inc. | CONN EDGE DUAL FMALE 30POS 0.156 | Box | Board Edge, Straddle Mount | 305 | -40°C ~ 105°C | |
![]() 305-030-556-578 $10.21 | EDAC Inc. | CONN EDGE DUAL FMALE 30POS 0.156 | Box | Board Edge, Straddle Mount | 305 | -40°C ~ 105°C | |
![]() 305-032-500-201 $6.10 | EDAC Inc. | CONN EDGE DUAL FMALE 32POS 0.156 | Box | Free Hanging (In-Line) | 305 | -40°C ~ 105°C | |
![]() 305-032-500-202 $6.10 | EDAC Inc. | CONN EDGE DUAL FMALE 32POS 0.156 | Box | Panel Mount | 305 | -40°C ~ 105°C | |
![]() 305-032-500-203 $7.95 | EDAC Inc. | CONN EDGE DUAL FMALE 32POS 0.156 | Box | Panel Mount | 305 | -40°C ~ 105°C | |
![]() 305-032-500-204 $6.10 | EDAC Inc. | CONN EDGE DUAL FMALE 32POS 0.156 | Box | Panel Mount | 305 | -40°C ~ 105°C |
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395-096-555-208View Product
845-072-525-103View Product
307-076-522-278View Product
895-012-525-512View Product
896-008-559-112View Product
387-042-521-202View Product
746-082-541-606View Product
EBC25DCTS-S288View Product
316-018-500-104View Product
GBC31DRYH-S93View Product
807-013-445-104View ProductLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
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