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305-030-556-558 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 30POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-030-556-558 is a standard card edge connector from the 305 series, designed for panel mounting in a vertical orientation. It features a dual-row configuration with 30 positions and a pitch of 3.96 mm (0.156 inches). The connector supports board thicknesses of 1.57 mm and utilizes gold-plated copper alloy contacts with solder pin termination. Rated for 5 A current, it operates within a temperature range of -40°C to +105°C and employs thermoplastic insulation.
Verify component authenticity through authorized EDAC distributors or direct manufacturer channels. Confirm RoHS compliance status and specific lot traceability requirements prior to acquisition. Ensure storage conditions maintain integrity of gold plating and prevent moisture absorption in the thermoplastic housing before assembly.
Select this model when a 30-position dual-row interface is required with a 3.96 mm pitch. Verify that the target PCB thickness aligns with the specified 1.57 mm dimension for proper engagement. Consider the vertical panel mount style and solder pin termination method against available board space and assembly processes.
This component belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and mounting configurations, all sharing a consistent 3.96 mm pitch. The 305-030-556-558 specifically addresses applications needing a moderate density dual-row connection with robust thermal and electrical ratings.
Cross-reference with other EDAC 305 series variants such as 305-030-556-204 or 305-030-556-508 if different termination styles or housing colors are needed. Ensure substitute parts maintain the same 3.96 mm pitch and 30-position count to guarantee mechanical compatibility.
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