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Products in this family are interconnect products used in conjunction with Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) materials, and are predominantly of the sort which perform a cable-to-board interconnect function, being mounted to a printed circuit board, and providing both electrical connection and mechanical retention for an inserted FFC or FPC cable.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 5047543120 $1.24 | Molex | CONN FPC 31POS 0.3MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 85°C | |
![]() 5047543140 $0.60 | Molex | 0.3 FPC B/F HITEMP W/LCK 31CKTEM | Tape & Reel (TR) | - | * | - | |
![]() 5047543160 $1.17 | Molex | 0.3 FPC B/F HITEMP 31CKTEMBSTPPK | Tape & Reel (TR) | - | * | - | |
![]() 5047543300 $1.31 | Molex | CONN FPC 33POS 0.3MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 85°C | |
![]() 5047543320 $1.31 | Molex | CONN FPC 33POS 0.3MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 85°C | |
![]() 5047543340 $1.40 | Molex | 0.3 FPC B/F HITEMP W/LCK 33CKTEM | Tape & Reel (TR) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 125°C | |
| Molex | CONN FPC 0.3MM | Tape & Reel (TR) | - | BackFlip, Easy-On LA75 504754 | -40°C ~ 105°C | ||
![]() 5047543360 $1.21 | Molex | 0.3 FPC B/F HITEMP 33CKTEMBSTPPK | Tape & Reel (TR) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 125°C |
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Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
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CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
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Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
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