SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in this family are interconnect products used in conjunction with Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) materials and are predominantly of the sort which perform a cable-to-board interconnect function, being mounted to a printed circuit board, and providing both electrical connection and mechanical retention for an inserted FFC or FPC cable.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 5047543760 $1.28 | Molex | 0.3 FPC B/F HITEMP 37CKTEMBSTPPK | Tape & Reel (TR) | - | * | - | |
![]() 5047543900 $1.53 | Molex | CONN FPC 39POS 0.3MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 85°C | |
![]() 5047543920 $1.53 | Molex | CONN FPC 39POS 0.3MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 85°C | |
![]() 5047543940 $0.77 | Molex | 0.3 FPC B/F HITEMP W/LCK 39CKTEM | Tape & Reel (TR) | - | * | - | |
![]() 5047543960 $1.31 | Molex | 0.3 FPC B/F HITEMP 39CKTEMBSTPPK | Tape & Reel (TR) | - | * | - | |
![]() 5047544100 $1.60 | Molex | CONN FPC 41POS 0.3MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 85°C | |
![]() 5047544120 $1.60 | Molex | CONN FPC 41POS 0.3MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 85°C | |
![]() 5047544140 $0.80 | Molex | 0.3 FPC B/F HITEMP W/LCK 41CKTEM | Tape & Reel (TR) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 125°C |
TOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More