SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in this family are interconnect products used in conjunction with Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) materials and are predominantly of the sort which perform a cable-to-board interconnect function, being mounted to a printed circuit board, and providing both electrical connection and mechanical retention for an inserted FFC or FPC cable.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 5047542100 $1.02 | Molex | CONN FPC 21POS 0.3MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 85°C | |
![]() 5047542120 $1.02 | Molex | CONN FPC 21POS 0.3MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 85°C | |
![]() 5047542140 $1.20 | Molex | 0.3 FPC B/F HITEMP W/LCK 21CKTEM | Tape & Reel (TR) | - | * | - | |
![]() 5047542160 $1.01 | Molex | 0.3 FPC B/F HITEMP 21CKTEMBSTPPK | Tape & Reel (TR) | - | * | - | |
![]() 5047542500 $1.11 | Molex | CONN FPC 25POS 0.3MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 85°C | |
![]() 5047542520 $1.11 | Molex | CONN FPC 25POS 0.3MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 85°C | |
![]() 5047542540 $0.53 | Molex | 0.3 FPC B/F HITEMP W/LCK 25CKTEM | Tape & Reel (TR) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 125°C | |
![]() 5047542560 $1.07 | Molex | 0.3 FPC B/F HITEMP 25CKTEMBSTPPK | Tape & Reel (TR) | Surface Mount, Right Angle | BackFlip, Easy-On LA75 504754 | -40°C ~ 125°C |

Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More