SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in this family are used for the reproduction of analog signals with an attendant increase in amplitude, reduction of source impedance, and/or isolation of a signal source from a driven load, as well as performing mathematical operations on analog signals such as summation, negation, integration, etc. Instrumentation amplifiers, chopper stabilized/auto-zero/zero-drift amplifiers, and current feedback types are included.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Renesas Electronics Corporation | IC OPAMP GP 4 CIRCUIT 14SOIC | Tube | 14-SOIC | Surface Mount | EL8401 | -40°C ~ 85°C | |
| Renesas Electronics Corporation | IC OPAMP GP 4 CIRCUIT 14SOIC | Tape & Reel (TR) | 14-SOIC | Surface Mount | EL8401 | -40°C ~ 85°C | |
![]() EL8401ISZ-T13 $6.60 | Intersil | IC OPAMP GP 4 CIRCUIT 14SOIC | Bulk | 14-SOIC | Surface Mount | EL8401 | -40°C ~ 85°C |
| Renesas Electronics Corporation | IC OPAMP GP 4 CIRCUIT 14SOIC | Tape & Reel (TR),Cut Tape (CT) | 14-SOIC | Surface Mount | EL8401 | -40°C ~ 85°C | |
| Renesas Electronics Corporation | IC OPAMP GP 4 CIRCUIT 16QSOP | Tube | 16-QSOP | Surface Mount | EL8401 | -40°C ~ 85°C | |
![]() EL8401IU $2.67 | Elantec | IC OPAMP GP 4 CIRCUIT 16QSOP | Tube | 16-QSOP | Surface Mount | EL8401 | -40°C ~ 85°C |
![]() EL8401IUZ $5.29 | Intersil | IC OPAMP GP 4 CIRCUIT 16QSOP | Tube | 16-QSOP | Surface Mount | EL8401 | -40°C ~ 85°C |
| Renesas Electronics Corporation | IC OPAMP GP 4 CIRCUIT 16QSOP | Tape & Reel (TR) | 16-QSOP | Surface Mount | EL8401 | -40°C ~ 85°C |

Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More