SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Phoenix Contact part number 1672263 is a Heavy Duty Power Connector housing, specifically the HC-STA-D07-BWSCM-M32-EL-AL model. It is designed for panel mounting with bottom entry and features an aluminum construction. The component provides IP66 and IP67 ingress protection ratings, ensuring it is dust-tight and waterproof. It operates within a temperature range of -40°C to +125°C and utilizes a screw termination type. This housing is compatible with HC-A03, A04, D07, D08, Q02, Q03, Q04, and Q05 contact inserts.
Verify that the specific ordering suffix matches the required cable gland size and mounting configuration. Confirm compatibility with the intended contact inserts before procurement. Ensure the aluminum housing variant is selected if corrosion resistance is required. Check lead times as production cycles may vary based on quantity requirements.
Select this housing when high ingress protection is critical for the installation environment. Choose this model for applications requiring robust mechanical strength and thermal stability up to 125°C. Consider the bottom entry design for specific cable routing constraints. Verify that the D7 size accommodates the necessary current carrying capacity of the chosen contacts.
This component belongs to the Phoenix Contact HC-STA series of heavy-duty connectors. The series is engineered for demanding industrial environments where reliable power and signal transmission are essential. The HC-STA housings provide standardized interfaces for various contact modules, ensuring interoperability within the broader connector ecosystem.
No public confirmed substitute part numbers are available in the provided documentation.

Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More