1N3064

Single Diodes Overview

The Microsemi Corporation 1N3064 is a small signal switching diode designed for through-hole mounting in DO-35-2 packages. It operates as a signal or computer diode with a maximum repetitive peak reverse voltage of 75V and a continuous forward current rating of 75mA. The component weighs approximately 137 mg and is classified under small signal switching diodes within the diodes and rectifiers sub-category.

Single Diodes Feature Summary

• Through-hole installation capability utilizing DO-35-2 axial leaded glass packaging
• Designed for high-speed signal switching and computer logic applications
• Hermetically sealed construction ensuring environmental stability

Single Diodes Applications

• High-speed digital logic circuits
• Signal rectification in low-power systems
• Computer interface protection

Single Diodes Procurement Notes

Verify the specific manufacturer designation, as Microchip Technology also lists this part number. Confirm RoHS compliance status, as sources indicate non-compliance for the Microchip version. Ensure the package matches the required DO-35-2 form factor for your PCB layout constraints before finalizing procurement.

Single Diodes Selection Notes

Select this component when a hermetically sealed, high-reliability switching diode is required for through-hole assembly. The 75V reverse voltage rating suits moderate voltage signal lines. Verify that the 75mA forward current capacity meets the circuit requirements, as higher current applications may require alternative rectifier types.

Single Diodes Part Context

This component belongs to the standard small-signal switching diode family used in military and aerospace electronics. It provides reliable performance in harsh environments due to its voidless glass construction. The part serves as a fundamental discrete semiconductor element for signal processing tasks.

Single Diodes Replacement Considerations

Cross-reference with other MIL-PRF qualified equivalents if supply chain constraints exist. Verify pinout compatibility and thermal characteristics against potential substitutes from different manufacturers.