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1N3339RB is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE ZENER 91V 50W DO5. Review the specifications below when checking this part for your BOM.
The Microchip Technology 1N3339RB is a high-power 50 W Zener diode from the JEDEC registered 1N3305 through 1N3350B series. It provides voltage regulation with a nominal Zener voltage of 82 V at a test current of 150 mA. The device features a maximum dynamic impedance of 11 Ohms and a maximum reverse current of 10 µA. It operates within a junction temperature range of -65°C to +175°C and utilizes a DO-5 (DO-203AB) package with an R suffix indicating reversed polarity (cathode to case).
Verify the specific part number against official Microchip documentation to confirm the 'R' suffix denotes reversed polarity (cathode to case) and the 'B' suffix indicates a 5% tolerance. Ensure mounting hardware matches the 11/16 inch hexagonal stud with 1/4-28 threads specified in the datasheet. Confirm thermal management requirements align with the 50 W dissipation rating at a case temperature below 75°C.
Select this component when a high-power 50 W Zener diode with a nominal 82 V breakdown is required. The reversed polarity configuration suits applications where the cathode must connect to the heatsink or case. Verify that the system can accommodate the DO-5 stud mount package and provide sufficient thermal resistance to maintain junction temperatures within the specified -65°C to +175°C range during operation.
This device belongs to the Microsemi Scottsdale Division 1N3305 thru 1N3350B series, which offers a broad selection of voltages from 3.9 V to 200 V. These diodes are designed for high-power applications up to 50 W with low thermal resistance. The series also includes military qualifications such as JAN, JANTX, and JANTXV, providing options for different screening levels and reliability requirements in demanding environments.
Consult the manufacturer for surface mount equivalents if board space constraints require alternative packaging. Verify compatibility with existing thermal management solutions due to the 50 W power dissipation capability and stud mount mechanical interface.
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