1N4534UR

Single Diodes Overview

The Microsemi Corporation 1N4534UR is a hermetically sealed glass switching diode in a DO-34 outline. It features metallurgically bonded double plug construction and copper clad steel leads with tin/lead finish. The device supports military qualifications including JAN, JANTX, and JANTXV per MIL-PRF-19500/337. Maximum ratings include 50V DC reverse voltage, 500mW total power dissipation, and an operating temperature range of -65°C to +175°C. Electrical characteristics specify a maximum reverse leakage current of 5µA at 50V and a maximum reverse recovery time of 4ns.

Single Diodes Feature Summary

• Hermetically sealed glass package with internal metallurgical bond
• Double plug construction for high reliability
• Qualified to JAN, JANTX, and JANTXV military standards

Single Diodes Applications

• High-reliability military switching circuits
• Fast recovery applications requiring low capacitance
• Harsh environment electronics within specified thermal limits

Single Diodes Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm exact qualification level and testing requirements. Ensure the component matches the required MIL-PRF-19500/337 standard. Confirm lead material and finish specifications align with system constraints. Validate that the DO-34 package dimensions meet board layout requirements. Cross-reference datasheet revisions for any updates to electrical parameters or marking codes.

Single Diodes Selection Notes

Select this component when a fast-switching diode with low junction capacitance is required in a ruggedized form factor. The DO-34 package provides a compact solution for space-constrained designs. Consider the thermal resistance and derating factors for high-temperature operation scenarios. Verify compatibility with existing circuit voltages and current limits before integration.

Single Diodes Part Context

This part belongs to the Microsemi switching diode family designed for demanding environments. It utilizes a glass encapsulation process to ensure long-term stability and protection against moisture ingress. The metallurgical bond enhances mechanical strength and thermal performance compared to standard epoxy packages.

Single Diodes Replacement Considerations

Direct replacements must match the DO-34 outline and maintain equivalent electrical characteristics. Verify that substitute parts offer comparable reverse recovery times and leakage currents. Ensure alternative components support the same military qualification levels if required by the design specification.