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1N4765A/TR
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Product Detailed Parameters
- Description：DIODE ZENER 9.1V 500MW DO204AH
- Series：-
- Mfr：Microchip Technology
- Package：Tape & Reel (TR)
- Voltage - Zener (Nom) (Vz)：9.1 V
- Tolerance：±5%
- Power - Max：500 mW
- Impedance (Max) (Zzt)：350 Ohms
- Current - Reverse Leakage @ Vr：-
- Operating Temperature：-55°C ~ 100°C
- Mounting Type：Through Hole
- Package / Case：DO-204AH, DO-35, Axial
- Voltage - Forward (Vf) (Max) @ If：-
- Grade：-
- Qualification：-
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Overview
The Microchip Technology 1N4765A/TR is a temperature-compensated Zener reference diode with a nominal voltage of 9.1 V and a tolerance of ±5%. It operates in the DO-204AA-2 (DO-15) package, dissipating up to 500 mW at +50°C with a derating factor of 4 mW/°C above this threshold. The device supports an extended operating temperature range from -65°C to +175°C. Key electrical characteristics include a maximum reverse leakage current of 10 µA at 25°C and 6 Vdc, a Zener impedance of 350 Ohms, and a test current of 500 µA.
Feature Summary
- Temperature compensated design for stable reference performance
- Metallurgically bonded construction with double plug technology
- Extended high-temperature operational capability
Applications
- Precision voltage reference circuits
- Temperature compensated regulation systems
- Low current range applications requiring stable biasing
Procurement Notes
Verify the specific suffix configuration against official datasheets to ensure compatibility with required packaging and testing standards. Confirm that the component meets all necessary environmental compliance requirements for the intended deployment environment before finalizing procurement orders.
Selection Notes
Select this component when a stable voltage reference is required across wide temperature variations. Ensure the circuit design accommodates the specified 500 mW power dissipation limits and the 350 Ohm impedance characteristics at the designated test current levels.
Part Context
This part belongs to the 1N4765 series of temperature-compensated Zener diodes manufactured by Microchip Technology. These devices are engineered for applications demanding high stability and low noise, utilizing specialized metallurgical bonding techniques to maintain performance integrity under varying thermal conditions.
Replacement Considerations
Consult official substitution guides for compatible alternatives. Verify pinout compatibility and electrical parameter alignment before integrating any substitute components into existing designs.
