SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff part number 23130164 is identified as an assembly kit designed for rear panels within the nVent SCHROFF product line. This component serves as a structural accessory for professional enclosure and system technology applications, supporting the integration of rear panel modules in industrial and measurement environments.
Verify the exact specification sheet for the 23130164 assembly kit to confirm compatibility with specific rack dimensions and mounting requirements. Ensure that the kit matches the intended rear panel type and system series before procurement to avoid installation issues.
Select this assembly kit only if it corresponds to the specific rear panel model and rack series required for your application. Confirm mechanical fitment and material specifications against the official datasheet to ensure structural integrity and proper alignment within the enclosure system.
This part belongs to the nVent SCHROFF range of electronics packaging solutions, which includes cabinets, subracks, and backplanes. The company specializes in standard products for industry, research, and measurement technology, providing comprehensive enclosure and system technology.
No public confirmed substitute part numbers are available for this specific assembly kit. Verify compatibility with existing rack systems before considering alternative components.

Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
Understand tactile switches, PCB and keyboard differences, four-pin wiring, debounce, force, travel and replacement checks for reliable control inputs.
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More