SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 24813910 is a steel cabinet accessory finished in grey, designed for use with Interscale M electronic enclosures. It measures 221 mm in length and 399 mm in width. The component features an elevated mounting plate type with a 4mm height specification. It complies with CSA, VDE, UL 94 V-0, UL, and EN 50022 standards.
Verify the manufacturer part number 24813910 against official nVent SCHROFF documentation to ensure compatibility with Interscale M systems. Confirm that the required dimensions of 221 mm by 399 mm match the specific enclosure model. Check compliance requirements for CSA, VDE, and UL standards relevant to the intended deployment environment before finalizing procurement.
Select this component when integrating hardware into Interscale M electronic enclosures requiring a steel mounting solution. Ensure the application demands compliance with EN 50022 standards. Verify that the 4mm elevation profile meets spatial constraints within the chassis. Confirm material suitability for the environmental conditions of the installation site.
This component belongs to the nVent SCHROFF range of cabinet accessories. It serves as a structural element for electronic enclosures, providing mounting support. The product line focuses on industrial-grade hardware compliant with international safety and performance standards for rack-mounted applications.
Public confirmed substitute part numbers are not available in the provided data.

Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More