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302-070-621-201 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is 302 SERIES (.05" (1.27MM) CONTAC. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 302-070-621-201 is a standard card edge connector from the 302 Series, designed for dual-edge board applications. It features 70 positions with a female contact type and a 0.050 inch (1.27mm) pitch. The connector utilizes gold-plated contacts on a black insulator made of polyamide (PA66). It supports board thicknesses ranging from 0.051 to 0.071 inches (1.30mm to 1.80mm) and operates within a temperature range of -55°C to 85°C.
Verify that the target printed circuit board thickness falls within the specified 0.051 to 0.071 inch range to ensure proper mechanical retention and electrical contact. Confirm that the mating card edge has compatible gold plating specifications to prevent galling during insertion cycles. Ensure soldering profiles align with the thermal limits of the polyamide housing to maintain structural integrity during assembly processes.
Select this component when a high-density connection with a 1.27mm pitch is required for dual-edge cards. The 70-position count suits moderate-to-high I/O requirements. Consider the black color coding if visual differentiation from other connectors in the assembly is necessary. Verify that the panel-mount or through-hole soldering method matches the manufacturing capabilities of the host PCB design.
This part belongs to the EDAC 302 Series, which focuses on standard card edge connectors with a 0.050-inch spacing. The series offers various position counts and termination styles. The 302-070-621-201 specifically addresses the need for robust connections in environments requiring wide operating temperatures and durable contact materials.
Direct substitutes include other EDAC 302 Series parts with identical 70-position, dual-edge, and 0.050-inch pitch configurations, such as 302-070-621-202 if different termination is needed. Cross-brand replacements require matching pitch, position count, and board thickness constraints.
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