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305-024-500-208 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 24POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-024-500-208 is a standard card edge connector featuring 24 positions with a 3.96 mm pitch. Designed for dual-edge card insertion, it utilizes gold-plated copper alloy contacts to ensure reliable signal transmission. The component supports a continuous current rating of 5 A and withstands 1800 VACrms dielectric voltage. It accommodates PCB thicknesses of 1.57 mm and operates within a temperature range of -40°C to +105°C. The housing is constructed from green thermoplastic material, providing necessary insulation and mechanical stability for panel-mounted applications.
Verify the specific suffix codes against official EDAC documentation to confirm exact termination style and mounting variations. Ensure compatibility with existing polarizing key requirements before integration. Cross-reference the datasheet for precise dimensional tolerances and thermal ratings to validate suitability for the target operating environment.
Select this model when a 24-position dual-edge connector with a 3.96 mm pitch is required. Consider the 5 A current rating and 1800 VACrms insulation capability for high-reliability applications. Verify that the target PCB thickness aligns with the specified 1.57 mm requirement for proper mechanical fit and electrical performance.
This component belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and termination options while maintaining consistent pitch and housing dimensions. This specific part number represents a 24-position variant designed for dual-edge card applications with gold-plated contacts.
Consult official EDAC substitution lists for verified alternative part numbers. Generic equivalents may not support the specific polarizing key mechanisms or dielectric voltage ratings required for this application.
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