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305-026-500-501 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 26POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-026-500-501 is a standard card edge connector from the 305 series, designed for reliable signal transmission in electronic assemblies. It features a dual-row configuration with 26 positions and a precise pitch of 3.96 mm (0.156 inches). The component supports a maximum board thickness of 1.57 mm and utilizes gold-plated copper alloy contacts to ensure low resistance and durability. Rated for 5 A current, it employs a solder eyelet termination method suitable for through-hole PCB mounting. Constructed with thermoplastic insulation, it operates within a temperature range of -40°C to +105°C and maintains an insulation resistance of 5 GOhms.
Verify the specific suffix codes against official EDAC documentation to confirm exact pin count, plating specifications, and termination type. Ensure compatibility with target PCB stack-up dimensions and thermal requirements before integration. Cross-reference part numbers with authorized distributors to avoid counterfeit components.
Select this connector when a dual-row card edge interface with 26 positions is required. Confirm that the mating card thickness aligns with the 1.57 mm specification. Evaluate current load requirements against the 5 A rating and verify that the operating environment falls within the specified temperature limits.
This component belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and mounting options, utilizing a consistent 3.96 mm pitch. These connectors are engineered for robust mechanical stability and reliable electrical connections in demanding industrial and commercial environments.
Compatible substitutes within the same series include 305-026-500-508 and 305-026-521-501. Verify that alternative part numbers match the required 26-position count, dual-row layout, and solder eyelet termination style before substitution.
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