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305-066-556-212 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 66POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-066-556-212 is a standard card edge connector header from the 305 series, designed for vertical panel mounting. It features 66 positions with a 3.96 mm pitch and supports a board thickness of 1.57 mm. The contacts are gold-plated copper alloy, rated for 5 A current, and utilize solder pin termination. The housing is thermoplastic, providing an insulation resistance of 5 GOhms and operating within a temperature range of -40°C to +105°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm contact plating, housing material, and termination style match the application requirements. Ensure the target printed circuit board thickness aligns with the specified 1.57 mm tolerance to guarantee proper mechanical engagement and electrical performance during assembly.
Select this component when a dual-row, 66-position interface is required for vertical panel mounting applications. The 3.96 mm pitch accommodates standard card edge layouts, while the gold-plated copper alloy contacts provide durability for repeated mating cycles. Confirm that the thermal rating of +105°C meets the environmental conditions of the intended deployment scenario.
This part belongs to the EDAC 305 series of standard card edge connectors, which are engineered for general-purpose electronic interconnections. The series offers various position counts and mounting styles, utilizing thermoplastic housings and solder pin terminations to support diverse PCB integration needs across multiple industrial sectors.
Cross-reference compatible parts within the EDAC 305 series family for alternative position counts or mounting angles. Verify that any substitute maintains the same 3.96 mm pitch and 1.57 mm board thickness compatibility to ensure mechanical fit without redesigning the host PCB footprint.
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