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305-072-520-268 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 72POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-072-520-268 is a standard card edge connector receptacle featuring 72 positions arranged in two rows. It utilizes a 3.96 mm (0.156 inch) contact spacing with a 3.56 mm row pitch. Designed for .062 inch (1.57 mm) nominal thickness printed circuit boards, it employs gold-plated copper alloy contacts rated at 5 A. The unit uses a green thermoplastic polyester insulator body and supports solder termination via straight PCB mount installation.
Verify the specific ordering suffix to confirm plating thickness, insulation color, and termination style match project requirements. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure that the selected variant aligns with the designated panel or PCB mounting configuration to avoid mechanical incompatibility during assembly.
Select this component when a dual-row connection is required for high-density applications utilizing standard .062 inch board thicknesses. The 3.96 mm pitch accommodates larger gauge traces compared to finer pitches. Verify that the 5 A current rating and +105 C maximum operating temperature meet the thermal and electrical demands of the target application environment.
This part belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and mounting styles to support diverse electronic interface needs. The 305-072-520-268 specifically addresses the need for robust, high-pin-count connections in space-constrained industrial and commercial electronics assemblies.
Cross-reference compatible parts within the EDAC 305 series based on identical pin count, pitch, and mounting orientation. Verify that alternative suppliers offer components with matching electrical ratings and physical dimensions to ensure seamless interchangeability without redesigning the host circuit board.
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