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305-074-556-502 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 74POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-074-556-502 is a dual female card edge connector designed for board-to-board interconnection. It features 74 positions with a 0.156-inch (3.96mm) spacing across two rows. The connector utilizes gold-plated contacts and a green thermoplastic insulator, supporting PCB thicknesses between 0.054 and 0.070 inches. Rated for operation from -40°C to 105°C, it employs a solder termination method and includes flange features for secure panel mounting.
Verify the specific part number against official EDAC documentation to confirm pin count and plating specifications. Ensure compatibility with target PCB thickness and mounting hole dimensions. Confirm RoHS3 compliance status if required by project regulations. Cross-reference ordering guides for accurate packaging quantities and lead times before finalizing procurement plans.
Select this component when a high-density dual-row interface is required for rigid PCBs. Evaluate the 0.156-inch pitch against available routing space. Consider the operating temperature range relative to the environment. Verify that the gold plating meets conductivity requirements for the intended application signals.
This connector belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and termination styles. The 305-074 variant specifically addresses applications requiring extensive I/O lines in a compact footprint. It complements other EDAC products by providing standardized mechanical dimensions for easy integration into existing designs.
Direct substitutes within the same series include 305-074-556-501 and 305-074-556-278. These alternatives share identical mechanical form factors but may differ in plating thickness or environmental compliance ratings. Verify electrical characteristics and material specifications before substituting to ensure functional equivalence.
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