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305-076-520-503 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 76POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-076-520-503 is a standard card edge connector featuring 76 positions with a 3.96 mm pitch. Designed for dual-edge female contact interfaces, it utilizes gold-plated copper alloy terminals to ensure reliable signal transmission. The component supports a continuous current rating of 5 A and withstands 1800 VACrms dielectric voltage. It accommodates PCB thicknesses of 1.57 mm and operates within a temperature range of -40°C to +105°C. The housing is constructed from thermoplastic polyester, providing structural stability and insulation resistance of 5 GOhms.
Verify the specific ordering suffix against the official EDAC datasheet to confirm pin count, plating specifications, and mounting style. Ensure compatibility with the target PCB thickness of 1.57 mm and verify that the polarizing key requirements match the system design constraints before finalizing procurement orders.
Select this model when a 76-position interface with a 3.96 mm pitch is required. It is suitable for applications demanding a 5 A current rating and operation up to +105°C. Consider the dual-edge female configuration and panel or PCB mount options based on the mechanical assembly requirements.
This component belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and pitch options, designed for general-purpose interconnect solutions. The 305 series is characterized by its durable thermoplastic housing and standardized electrical ratings, making it a common choice across multiple industrial sectors.
Cross-reference with other EDAC 305 series variants such as 305-072-520-204 or 305-072-520-504 for similar pitch and row configurations. Verify that substitute parts match the exact position count and mounting orientation to ensure mechanical fit.
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