SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 30849755 is a front panel component designed for 3U height and 4HP width configurations within electronic enclosure systems. It features a 2x25 way connector interface, facilitating signal routing and connectivity for plug-in units. Constructed as a box component, this part serves as a structural and electrical interface element in modular rack environments.
Verify the specific connector pinout and mating requirements against the target backplane or cable assembly before procurement. Confirm that the 3U 4HP form factor aligns with the existing rack infrastructure. Ensure compatibility with the intended plug-in unit depth and mechanical retention standards to guarantee proper installation and electrical continuity.
Select this component when a 3U height and 4HP width are required with integrated 2x25 way connectivity. It is suitable for applications needing a dedicated front panel for signal distribution rather than simple blanking. Consider mechanical stability and connector density requirements when evaluating alternatives.
This part belongs to the Schroff range of box components and front panels, which are widely used in industrial electronics packaging. The product line supports various bus architectures including VME and CompactPCI, providing standardized mechanical and electrical interfaces for modular system construction.
Check for exact dimensional matches (3U x 4HP) and identical 2x25 way connector specifications. Verify that any substitute maintains the same material properties and mounting hole patterns to ensure seamless integration into existing chassis designs.

Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read MoreA digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More