335-10-123-00-160000

Headers, Male Pins Overview

The Mill-Max 335-10-123-00-160000 is a vertical header connector featuring 23 positions with a 0.100 inch (2.54 mm) pin spacing. It utilizes a through-hole termination method and accepts pins within a diameter range of 0.015 to 0.025 inches. The contact surfaces are finished with 10 microinches of gold plating over 100 microinches of nickel. Designed for high-temperature environments, the unit operates reliably between -55°C and 125°C.

Headers, Male Pins Feature Summary

• Vertical orientation design for standard board mounting
• Gold-plated contacts ensure reliable signal transmission
• High-temperature resistant construction for demanding conditions

Headers, Male Pins Applications

• Industrial control systems requiring robust interconnects
• Test and measurement equipment interfaces
• High-temperature electronic assemblies

Headers, Male Pins Procurement Notes

Verify the specific pin count and spacing against schematic requirements before ordering. Confirm that the operating temperature range aligns with the application environment. Ensure the through-hole footprint matches the PCB layout dimensions precisely to avoid assembly issues.

Headers, Male Pins Selection Notes

Select this component when a vertical header with precise 2.54mm spacing is required. Consider the gold plating thickness for corrosion resistance needs. Evaluate the high-temperature rating against potential thermal stress in the final assembly to ensure long-term reliability.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 335 series of headers. It provides a standardized solution for connecting peripheral devices or modules. The series offers various position counts and configurations to suit different circuit density requirements while maintaining consistent mechanical and electrical characteristics.

Headers, Male Pins Replacement Considerations

Cross-reference compatible parts from other manufacturers offering identical 23-position, 2.54mm pitch vertical headers. Verify that substitute components match the physical dimensions and terminal compatibility to ensure seamless integration without redesigning the host board.