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337-033-524-602 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 33POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 337-033-524-602 is a standard card edge connector from the 337 series, designed for reliable signal transmission in electronic assemblies. It features 33 positions with a 3.96 mm pitch and accommodates a board thickness of 1.57 mm. The component utilizes through-hole mounting with a vertical orientation and gold-plated copper alloy contacts rated for 3 A. The housing is constructed from thermoplastic polyester, ensuring durability across an operating temperature range of -40°C to +105°C.
Verify the specific suffix configuration against official EDAC documentation to confirm terminal type and plating specifications. Ensure compatibility with the target PCB stack-up and mating card dimensions before procurement. Cross-reference the manufacturer part number with authorized distributor catalogs to validate current availability and lead times.
Select this connector when a single-row, vertical interface is required for boards with a 1.57 mm thickness. The 3.96 mm pitch suits applications needing robust mechanical retention without excessive density. Verify that the 3 A current rating meets the circuit requirements and that the operating temperature range aligns with the environmental conditions of the final assembly.
This component belongs to the EDAC 337 series of standard card edge connectors, which are widely used in modular electronic designs. The series offers various position counts and mounting styles to accommodate different form factors. The 337-033-524-602 specifically addresses needs for medium-density connections with high reliability standards.
Consult the EDAC official cross-reference guide for verified substitutes. Generic equivalents may not match the precise 3.96 mm pitch or contact plating specifications.
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