SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 34561779 is a panel trim accessory designed for the EuropacPRO series. It is specified as an 84HP (Horizontal Pitch) trim intended for panel mounting applications within 19-inch rack systems. The component serves as a structural interface element, providing a finished edge and mounting surface for equipment installation. It is compatible with 3U height configurations in standard industrial enclosures.
Verify compatibility with existing EuropacPRO subrack models before procurement. Confirm that the 84HP dimension aligns with the specific chassis depth and width requirements of the target enclosure system. Ensure the material finish meets environmental standards for the installation location.
Select this trim when retrofitting or assembling EuropacPRO systems requiring an 84HP front panel interface. It is not a standalone enclosure but a critical accessory for completing the mechanical structure of compatible subracks. Ensure the host subrack supports the required horizontal pitch configuration.
This component belongs to the nVent SCHROFF EuropacPRO family, a widely used line of 19-inch rack accessories and subracks. The 34561779 item functions as a finishing and mounting aid, ensuring proper alignment and aesthetic completion for equipment installed within these standardized industrial frames.
No direct public substitute part numbers are confirmed for this specific trim. Compatibility is generally limited to the original EuropacPRO series design specifications.

Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More
Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More