SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 34562754 is a rack mounting plate designed for 19-inch enclosure systems. It features a horizontal pitch of 42 HP and a depth of 280 mm. Constructed from aluminum, the component serves as a structural accessory for electronic packaging. The natural color finish provides standard industrial aesthetics. This mounting plate supports equipment integration within standardized rack frameworks, ensuring secure positioning and alignment for modular hardware components in professional applications.
Verify the manufacturer part number 34562754 against official nVent SCHROFF documentation to confirm specifications. Ensure compatibility with 19-inch rack standards and 42 HP width requirements. Cross-reference technical datasheets for dimensional accuracy and material composition before procurement to avoid integration errors.
Select this component based on specific rack width requirements of 42 HP and depth constraints of 280 mm. Confirm that the aluminum construction meets environmental and durability needs. Ensure the mounting plate aligns with existing 19-inch infrastructure and supports the intended electronic module weight and form factor.
This product belongs to the nVent SCHROFF range of electronics packaging solutions. As a rack accessory, it complements other Schroff components like chassis and enclosures. The brand specializes in high-quality standard products for electronic packaging design and fabrication, offering innovative solutions for industrial and commercial applications.
No public confirmed substitute part numbers are available for this specific component.

Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
Understand tactile switches, PCB and keyboard differences, four-pin wiring, debounce, force, travel and replacement checks for reliable control inputs.
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read More