350-10-128-00-106000

$15.60

Description：CONN HEADER SMD 28POS 2.54MM
Series：350
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk

SKU:bdce0d6357da Category: Headers, Male Pins Brand: Mill-Max Manufacturing Corp.

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Product introduction

350-10-128-00-106000 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN HEADER SMD 28POS 2.54MM. Review the specifications below when checking this part for your BOM.

Headers, Male Pins specifications for 350-10-128-00-106000

Description：CONN HEADER SMD 28POS 2.54MM
Series：350
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk
Connector Type：Header
Contact Type：Male Pin
Pitch - Mating：0.100" (2.54mm)
Number of Positions：28
Number of Rows：1
Row Spacing - Mating：-
Number of Positions Loaded：All
Style：Board to Board
Shrouding：Unshrouded
Mounting Type：Surface Mount
Termination：Solder
Fastening Type：Push-Pull
Contact Length - Mating：0.142" (3.61mm)
Contact Length - Post：-
Overall Contact Length：-
Insulation Height：0.110" (2.79mm)
Contact Shape：Circular
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：10.0µin (0.25µm)
Contact Finish - Post：Gold
Contact Material：Brass Alloy
Insulation Material：Polycyclohexylenedimethylene Terephthalate (PCT)
Features：-
Operating Temperature：-
Ingress Protection：-
Material Flammability Rating：-
Insulation Color：Black
Current Rating (Amps)：-
Voltage Rating：-

Headers, Male Pins datasheet and documents for 350-10-128-00-106000

350-10-128-00-106000

Headers, Male Pins Overview

The Mill-Max Manufacturing Corp. model 350-10-128-00-106000 is a standard header connector designed for board-to-board interconnection applications. This component features a dual-row configuration with 128 total contact positions, arranged in two rows of 64 pins each. The connector utilizes a 0.100-inch (2.54 mm) centerline spacing to ensure precise alignment with mating sockets or PCB pads. Constructed with gold-plated contacts over a nickel underplate, the unit provides reliable signal transmission and corrosion resistance. It is engineered for surface mount technology (SMT) assembly, allowing for automated placement on printed circuit boards. The housing is typically made from high-temperature thermoplastic material to withstand reflow soldering processes while maintaining structural integrity during operation.

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