350-40-123-00-006000

Headers, Male Pins Overview

The Mill-Max 350-40-123-00-006000 is a vertical interconnect header designed for board-to-board applications. It features 23 positions with a 0.100 inch (2.54 mm) pitch. The connector utilizes through-hole termination and includes gold-plated contacts to ensure reliable signal transmission. It is constructed with a black thermoplastic insulator and operates within a temperature range of -65°C to +125°C, supporting voltages up to 300V AC.

Headers, Male Pins Feature Summary

• Vertical board-to-board interconnect design
• Gold-plated contact surfaces for durability
• Thermoplastic insulator construction

Headers, Male Pins Applications

• Board-to-board connections
• Electronic circuit assembly
• Signal interconnect systems

Headers, Male Pins Procurement Notes

Verify the specific pin count and pitch requirements against the target PCB layout before ordering. Confirm that the operating voltage and temperature ratings align with the system environment. Ensure compatibility with mating connectors regarding housing dimensions and alignment features.

Headers, Male Pins Selection Notes

Select this component when a vertical orientation is required for compact board stacking. The 2.54mm pitch ensures compatibility with standard spacing layouts. Consider the mechanical stability provided by the through-hole mounting style for robust physical connections in final assemblies.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 350 series headers, which are characterized by their vertical configuration and high-density capabilities. The series is widely used in electronic manufacturing for creating reliable electrical pathways between adjacent printed circuit boards.

Headers, Male Pins Replacement Considerations

Direct substitutes may include other 23-position, 2.54mm pitch vertical headers from different manufacturers. Verify that alternative parts match the exact height, contact plating specifications, and insulation material properties to maintain performance integrity.