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351-10-105-00-009000 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN HEADER VERT 5POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Mill-Max 351-10-105-00-009000 is a vertical pin header connector featuring five positions with a 2.54mm (0.100 inch) contact spacing. Designed for through-hole termination, this component utilizes a board-to-board stacking configuration within the 351 series. The connector employs male pins with a circular contact shape and push-pull fastening type. It is constructed with copper alloy contacts and PCT insulation, finished in black. The assembly tolerance is specified at +/-0.010 inches (.25mm).
Verify that the specific part number matches the required five-position configuration and 2.54mm pitch. Confirm that the through-hole mounting style aligns with the target printed circuit board layout. Ensure compatibility with standard assembly tolerances of +/-0.010 inches during integration planning.
Select this component when a low-profile vertical header is required for connecting two parallel boards. The five-position count suits simple signal or power distribution needs. Verify that the 2.54mm spacing matches existing connector standards on the mating side to ensure proper alignment and electrical continuity.
This part belongs to the Mill-Max 351 Interconnect Header series, which specializes in standard pin headers for board stacking. The series offers various position counts while maintaining consistent 2.54mm spacing. These connectors are widely used in modular electronic designs requiring reliable vertical interconnection between stacked circuit boards.
No public confirmed substitute part numbers are available for this specific model. Alternative solutions require matching the five-position count, 2.54mm pitch, and vertical through-hole form factor from other manufacturers.
The contact spacing is 2.54mm (0.100 inches).
This connector has five positions.
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