357-070-560-278

Edgeboard Connectors Overview

The EDAC Inc. 357-070-560-278 is a standard dual-edge card edge connector featuring 70 positions with a 3.96 mm pitch. It utilizes gold-plated copper alloy contacts and a black thermoplastic polyester housing. Designed for panel mounting at a right angle, it supports a maximum current of 5 A and operates within a temperature range of -40°C to +105°C. The unit includes flush mount flanges with top openings and threaded inserts.

Edgeboard Connectors Feature Summary

• Dual-edge female contact configuration for secure board insertion
• Panel-mount design with integrated flanges for stable mechanical support
• Gold-plated contacts ensure reliable signal transmission

Edgeboard Connectors Applications

• Medical interconnect systems
• Industrial control panels
• Agricultural technology equipment

Edgeboard Connectors Procurement Notes

Verify the specific ordering suffix against official EDAC documentation to confirm mechanical attributes such as flange type and plating thickness. Confirm RoHS compliance status through the manufacturer's latest datasheet or certification documents before finalizing procurement specifications.

Edgeboard Connectors Selection Notes

Select this component when a dual-row connection with a 3.96 mm pitch is required for panel-mounted applications. Ensure the mating PCB thickness aligns with the connector's design specifications. Verify that the operating environment remains within the specified -40°C to +105°C temperature range for optimal performance.

Edgeboard Connectors Part Context

This part belongs to the EDAC 357 series of standard card edge connectors. The series provides various position counts and mounting options for diverse electronic applications. The 357 series is characterized by its robust construction and compatibility with standard board edge designs.

Edgeboard Connectors Replacement Considerations

Consult official EDAC substitution guides for verified alternatives. Cross-reference pin count, pitch, and mounting style when evaluating potential substitutes.