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399-91-015-21-300000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is STANDARD SOCKET HEADER. Review the specifications below when checking this part for your BOM.
The Mill-Max 399-91-015-21-300000 is a spring-loaded pogo pin contact designed for rigorous electrical connections. It features a single row of 15 positions with a 0.100-inch (2.54mm) pitch. The component utilizes gold-plated beryllium copper contacts to ensure conductivity and durability. It supports a rated current of 3A and operates within a temperature range of -55°C to 125°C. The unit employs a press-fit termination method for secure PCB mounting.
Verify the specific contact configuration and termination style against the official datasheet before procurement. Confirm that the press-fit installation method aligns with the target printed circuit board design requirements. Ensure environmental specifications meet operational needs.
Select this component when high-reliability, repeatable connections are required for testing or temporary mating scenarios. Consider the spring-loaded mechanism for accommodating minor misalignments during engagement. Evaluate the gold plating thickness for expected cycle life requirements.
This part belongs to the Mill-Max 399 series of individual spring-loaded contacts. These components are engineered for precision interconnect solutions where standard connectors may not suffice due to space constraints or dynamic mating requirements.
Consult the manufacturer catalog for direct substitutes within the 399 series. Verify mechanical dimensions and electrical ratings match exactly before considering alternative suppliers.
The component uses a press-fit termination method for securing the contact to the printed circuit board.
The contacts are made from beryllium copper with a gold plating finish.
Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.

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