416-93-208-41-006000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 416-93-208-41-006000 is a single in-line package (SIP) socket designed for surface-mount or through-hole PCB integration. It features eight positions with a 0.1-inch (2.54mm) contact pitch. The component utilizes gold-plated contacts to ensure reliable signal transmission and corrosion resistance. This header-style connector supports standard IC mounting, providing a secure interface between the printed circuit board and integrated circuits.

Headers, Receptacles, Female Sockets Feature Summary

• Single in-line package configuration for compact circuit board layout
• Gold-plated contact surfaces for enhanced conductivity and durability
• Standard 0.1-inch pitch spacing compatible with common IC footprints

Headers, Receptacles, Female Sockets Applications

• Integrated circuit socketing for development boards
• Prototype testing environments requiring component interchangeability
• Consumer electronics assembly where IC replacement is necessary

Headers, Receptacles, Female Sockets Procurement Notes

Verify that the specific ordering suffix matches the required termination style and contact plating thickness. Confirm RoHS compliance status if environmental regulations apply to the end product. Ensure the selected variant aligns with the intended mounting method and thermal requirements of the target application.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a single-row socket is required for DIP or SIP packages. Evaluate the need for gold plating versus tin plating based on the operating environment and mating cycle expectations. Consider the physical dimensions and pitch compatibility with the target integrated circuit footprint before finalizing the design.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Mill-Max 416 series of standard solder tail sockets. These components are engineered for general-purpose electronic interconnects, offering robust mechanical stability and electrical performance. The series provides various pin counts and configurations to support diverse integrated circuit packaging standards.