FIFOs Memory 72T3655L6-7BB product image

72T3655L6-7BB

  • Description:IC FIFO ASYNC/SYN 2KX36 208PBGA
  • Series:72T
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:1a95e827fcad Category: Brand:

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72T3655L6-7BB is listed in the FIFOs Memory range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC FIFO ASYNC/SYN 2KX36 208PBGA. Review the specifications below when checking this part for your BOM.

FIFOs Memory specifications for 72T3655L6-7BB

  • Description:IC FIFO ASYNC/SYN 2KX36 208PBGA
  • Series:72T
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Memory Size:72K (2K x 36)
  • Function:Asynchronous, Synchronous
  • Data Rate:66MHz, 150MHz
  • Access Time:12ns, 3.8ns
  • Voltage - Supply:2.375 V ~ 2.625 V
  • Current - Supply (Max):70mA
  • Bus Directional:Uni-Directional
  • Expansion Type:Depth, Width
  • Programmable Flags Support:Yes
  • Retransmit Capability:Yes
  • FWFT Support:Yes
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:208-BGA
  • Supplier Device Package:208-PBGA (17x17)

FIFOs Memory datasheet and documents for 72T3655L6-7BB

72T3655L6-7BB

FIFOs Memory Overview

The Renesas 72T3655L6-7BB is a TeraSync FIFO memory device featuring 2.25Mbit capacity (2K x 36 bits) in a 208-PBGA package. It supports asynchronous and synchronous operations with data rates of 66MHz and 150MHz. Access times are specified at 12ns and 3.8ns respectively. The component operates on a 2.5V supply within the 2.375 V to 2.625 V range, drawing a maximum current of 90mA. It functions within a commercial temperature range of 0°C to 70°C.

FIFOs Memory Feature Summary

  • Supports flexible Bus-Matching for x36, x18, or x9 data flow configurations
  • Features clocked read and write controls for precise synchronization
  • Provides programmable flags and First Word Fall Through (FWFT) support

FIFOs Memory Applications

  • High-speed data buffering in telecommunications systems
  • Interface bridging between disparate clock domains in digital logic
  • Data storage in high-performance computing architectures

FIFOs Memory Procurement Notes

This part is officially obsolete as of January 3, 2024. Verify availability through authorized distributors for remaining stock only. Confirm RoHS non-compliance status prior to integration into regulated environments. Ensure compatibility with existing 208-PBGA footprints if retaining current board designs. Review Product Change Notices for any historical assembly site modifications affecting qualification.

FIFOs Memory Selection Notes

Select this component when a 36-bit wide interface is required for high-throughput applications. The TeraSync architecture enables seamless clock domain crossing without external handshaking logic. Consider the 208-PBGA form factor for space-constrained PCB layouts requiring surface-mount installation. Evaluate power consumption against system thermal constraints given the 90mA maximum supply current specification.

FIFOs Memory Part Context

Part of the IDT 72T series, which includes variants like the 72T36105 and 72T3675. These devices share similar TeraSync technology but differ in depth and speed grades. The 72T3655 specifically offers a 2K depth configuration, distinguishing it from deeper or faster alternatives within the same product family designed for varying buffer requirements.

FIFOs Memory Replacement Considerations

No direct public substitute part numbers are confirmed for this obsolete component. Designers must evaluate alternative FIFOs with matching 36-bit width and 208-PBGA packaging. Cross-reference electrical specifications such as access time and voltage ranges to ensure functional equivalence in existing circuit designs.

72T3655L6-7BB72T3655L6-7BB

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