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74HC245BQ-Q100X is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is IC TXRX NON-INVERT 6V 20DHVQFN. Review the specifications below when checking this part for your BOM.
The Nexperia 74HC245BQ-Q100X is an octal bus transceiver with 3-state outputs, designed for bidirectional data transfer. It operates within a supply voltage range of 2.0 V to 6.0 V and supports ambient temperatures from -40 °C to +125 °C. The device features CMOS low power dissipation and high noise immunity. Inputs include clamp diodes to interface with voltages exceeding VCC. It complies with JEDEC standards JESD8C (2.7 V to 3.6 V) and JESD7A (2.0 V to 6.0 V). Latch-up performance exceeds 100 mA per JESD 78 Class II Level B.
Verify the specific suffix 'BQ' corresponds to the DHVQFN20 package (SOT764-1) when sourcing. Confirm that the component meets the AEC-Q100 Grade 1 automotive qualification requirements for your target application environment. Ensure design compatibility with the specified supply voltage limits and thermal derating characteristics provided in the datasheet.
Select this component for designs requiring an 8-bit bidirectional interface with 3-state capability. The HC logic family provides CMOS input levels suitable for standard digital interfaces. Consider the DHVQFN20 package dimensions and thermal properties if PCB space is constrained. Verify that the operating voltage range aligns with the system's power supply rails.
This part belongs to the Nexperia 74HC245-Q100 series, which includes variants like the 74HCT245-Q100. The series offers multiple package options including SO20, TSSOP20, and DHVQFN20. All variants share the same functional description as octal bus transceivers but differ in physical packaging and specific electrical characteristics based on the logic family (HC vs HCT).
Direct substitutes include other 74HC245 variants in different packages such as 74HC245D or 74HC245PW, provided the pinout and electrical specifications match the design requirements. Cross-reference package dimensions and thermal resistance values when changing form factors.
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