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74LVC1G384GV-Q100H is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is IC SWITCH SPST-NCX1 10OHM SC74A. Review the specifications below when checking this part for your BOM.
The Nexperia 74LVC1G384GV-Q100H is a single pole, single throw (SPST) bilateral analog switch housed in a 5-lead SC-74A (SOT753) package. It operates on a wide supply voltage range from 1.65 V to 5.5 V and supports continuous switch currents up to 32 mA. The device features very low ON resistance, typically ranging from 6 Ω at 5 V to 7.5 Ω at 2.7 V. It includes Schmitt-trigger action for control inputs, ensuring tolerance to slow rise and fall times. Qualified to AEC-Q100 Grade 1 standards, it functions reliably across an ambient temperature range of -40 °C to +125 °C.
Verify the specific suffix GV corresponds to the SC-74A package configuration required for your PCB layout. Confirm that the Q100H designation aligns with your automotive quality requirements. Ensure the ordering code matches the exact revision level specified in the latest product data sheet before finalizing procurement orders.
Select this component when a compact SPST analog switch is needed for automotive applications requiring high reliability. The SC-74A package offers a balance of thermal performance and space efficiency. Verify that the maximum ON resistance at your operating current and voltage remains within acceptable limits for your signal integrity requirements.
This part belongs to the 74LVC1G384-Q100 family of bilateral switches manufactured by Nexperia. The family includes variants in TSSOP5 and XSON5 packages. All members share identical electrical characteristics and functionality, differing only in physical footprint and pinout orientation relative to the package type.
Direct substitutes include the 74LVC1G384GW-Q100H (TSSOP5 package) and the 74LVC1G384GZ-Q100H (XSON5 package). These parts maintain identical electrical specifications but require different footprints. Non-package compatible alternatives must be evaluated for pin-to-pin compatibility and thermal derating constraints.
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