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837-033-520-104 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 33POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 837-033-520-104 is a single-row card edge connector designed for high-temperature applications within the 837 Series. It features 33 female positions with a 0.156-inch (3.96mm) contact spacing. The connector utilizes wire wrap termination and cantilever spring contacts made of copper alloy with a gold surface finish. It is housed in a green DAP insulator, supports PCB thicknesses from 0.054 to 0.070 inches, and operates reliably between -40°C and +125°C.
Verify that the specific part number matches the required pin count and spacing before ordering. Confirm that the application environment stays within the specified -40°C to +125°C operational range. Ensure the target PCB thickness falls within the supported 0.054 to 0.070 inch window. Check for RoHS compliance requirements if applicable to your project standards.
Select this component when a single-row configuration with 33 positions is required. Choose this model for its wire wrap termination style rather than surface mount or through-hole soldering. Consider the 0.156-inch pitch if wider spacing is needed for high-voltage isolation or mechanical robustness compared to finer pitches.
This connector belongs to the EDAC 837 Series, which specializes in high-temperature card edge solutions. The series provides various position counts while maintaining consistent 0.156-inch spacing. The 837-033 variant specifically addresses applications needing 33 connection points with reliable performance under thermal stress.
Direct substitutes within the same series include other 837 models with different pin counts such as 837-016-541-101 or 837-014-540-858. Verify that any replacement maintains the 0.156-inch pitch and single-row format. Cross-reference datasheets to ensure identical termination and mounting specifications.
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