89114222SP

Overview

The 89114222SP is a rack thermal management component manufactured by Hoffman Enclosures, Inc. It belongs to the Rack Thermal Management category and is currently in an active production status. The unit is supplied in bulk packaging. This specific part number is associated with NVENT HOFFMAN ENCLOSURES product lines.

Feature Summary

• Designed for rack thermal management applications
• Compatible with ready-to-populate panel solutions

Applications

• Rack thermal management systems
• Automated drilling and tapping panel preparation
• Enclosure assembly integration

Procurement Notes

Verify the exact technical specifications and compatibility requirements against the official manufacturer datasheet before procurement. Confirm that the component meets the specific thermal management needs of the target rack system. Ensure the bulk packaging format aligns with handling capabilities. Cross-reference the part number with current NVENT HOFFMAN ENCLOSURES documentation to confirm active status and availability constraints.

Selection Notes

Select this component specifically for rack thermal management tasks within Hoffman Enclosures ecosystems. Evaluate its compatibility with automated panel preparation workflows involving drilling, tapping, and milling. Consider the bulk packaging implications for storage and handling. Verify that the thermal performance characteristics meet the operational requirements of the intended enclosure environment.

Part Context

This component is part of the Hoffman Enclosures, Inc. portfolio focused on rack thermal management. It supports the creation of ready-to-populate panels through automation. The product line emphasizes optimizing material and labor efficiency in enclosure assembly processes. It is distributed under the NVENT HOFFMAN ENCLOSURES brand identity.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source data. Consult official NVENT HOFFMAN ENCLOSURES documentation for potential cross-references or alternative models suitable for similar rack thermal management applications.