SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The 89118581SP is a compressor bracket mount manufactured by Hoffman Enclosures, Inc. It is classified as an enclosure mounting bracket designed to support enclosure airflow and heat removal. The component helps extend the service life of electrical enclosures by facilitating thermal management. It weighs 0.45 kilograms.
Verify the part number 89118581SP against official nVent Hoffman documentation to confirm it is the correct compressor bracket mount. Ensure compatibility with the specific enclosure model intended for installation. Check for any updated revision levels or superseded part numbers in current catalogs before finalizing procurement orders.
Select this bracket when active cooling via a compressor is required within an enclosure. It is suitable for applications needing dedicated airflow support structures. Consider the weight capacity and mounting interface requirements of the target enclosure to ensure proper fit and secure installation of the cooling assembly.
This component belongs to the Hoffman Enclosures accessory line, specifically categorized under panel accessories and mounting brackets. It complements the company's range of industrial electrical boxes and drawn series enclosures designed for safeguarding electrical controls in various environments.
No public confirmed substitute part numbers are available in the provided data. Consult official nVent Hoffman engineering resources for potential cross-references or alternative mounting solutions if this specific bracket is unavailable.

Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
Choose tactile switches by operating force, travel, actuator height, footprint and lifetime. Check debounce, sealing and the assembled button mechanism.
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More