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A-WBP-G004EG-03TB01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 1.50MM, 3P. Review the specifications below when checking this part for your BOM.
The A-WBP-G004EG-03TB01 is a wire-to-board header wafer manufactured by ASSMANN WSW Components. It features a 3-position configuration with a 3.00 mm pitch, designed for reliable electrical connections in compact electronic assemblies. The component utilizes a white housing made of color-coded plastic and contacts constructed from brass with selective gold flash plating on the contact area to ensure durability and low resistance. This through-hole or surface-mount compatible header is engineered for high mating force stability, rated at approximately 3.57 kgf, ensuring secure engagement with mating connectors.
Verify the specific pin count and pitch against the schematic before ordering. Confirm that the housing material and contact plating specifications meet the environmental requirements of the target application. Ensure compatibility with mating connectors from the same product family to maintain consistent mechanical and electrical performance standards.
Select this component when a 3-position connection is required with a 3.00 mm spacing. Consider the gold-plated contacts for applications demanding long-term reliability and low contact resistance. Evaluate the mechanical retention strength provided by the specified mating force to ensure robust assembly integrity under vibration conditions.
This part belongs to the A-WBP series of wire-to-board connectors from ASSMANN WSW Components. The series offers various position counts and pitches to accommodate diverse design needs. The manufacturer specializes in IC sockets and IDC connectors, providing a comprehensive range of connectivity solutions for flat cable and wire harness applications across multiple industries.
Compatible substitutes include other 3-position headers with identical 3.00 mm pitch and similar contact materials. Verify that alternative parts match the housing dimensions and mounting style to ensure physical interchangeability without modifying the printed circuit board footprint.
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