A-WBP-L003EG-07TB01

Headers, Male Pins Overview

The A-WBP-L003EG-07TB01 is a board-to-board connector header manufactured by Assmann WSW Components. It features 7 contacts arranged in a single row with a 1.25mm pitch. The connector utilizes male pins with tin plating and is designed for through-hole mounting. The housing is constructed from polyamide (PA66) material, rated for UL94 V-0 flammability. It supports a maximum current of 2A at 125VAC/DC.

Headers, Male Pins Feature Summary

• Through-hole mounting configuration for secure PCB attachment
• Male pin design compatible with corresponding socket connectors
• Polyamide insulation housing with UL94 V-0 rating

Headers, Male Pins Applications

• Electronic control unit interconnections
• Consumer device internal circuit boards
• Industrial control panel signal routing

Headers, Male Pins Procurement Notes

Verify the specific suffix against the manufacturer's latest datasheet to ensure compatibility with mating components. Confirm that the required contact count and pitch match the target PCB layout. Check for RoHS compliance status if environmental regulations apply to the end product assembly process.

Headers, Male Pins Selection Notes

Select this component when a low-profile, single-row header is required for tight spacing applications. Ensure the mating connector matches the 1.25mm pitch specification. Consider the through-hole termination method for robust mechanical stability during operation.

Headers, Male Pins Part Context

This part belongs to the A-WBP series of rectangular connectors from Assmann WSW Components. The series offers various contact counts and pitches to accommodate different density requirements on printed circuit boards. It is commonly used in compact electronic assemblies where space efficiency is critical.

Headers, Male Pins Replacement Considerations

Direct substitutes must maintain the 1.25mm pitch and 7-position configuration. Verify that alternative headers share the same through-hole termination style and male pin orientation to ensure physical and electrical compatibility without redesigning the PCB footprint.