ABP1208N

Overview

The ABP1208N is a non-metallic backplate manufactured by Hoffman Enclosures, Inc. Designed for use with compatible enclosure series, this component features a depth of 5.53 inches. It serves as an internal mounting surface within the enclosure assembly.

Feature Summary

• Constructed from non-metallic material to prevent electrical conductivity and corrosion.
• Provides a dedicated mounting surface for internal components.
• Features a specific depth dimension of 5.53 inches for structural integration.

Applications

• Internal mounting support for electronic modules.
• Component organization within industrial enclosures.
• Installation base for DIN rail or panel accessories.

Procurement Notes

Verify compatibility with the specific enclosure model intended for installation. Confirm that the non-metallic material properties meet the environmental requirements of the application site. Ensure the 5.53-inch depth aligns with the internal spatial constraints of the target housing unit before procurement.

Selection Notes

Select this part when a non-conductive mounting surface is required inside an enclosure. The fixed depth of 5.53 inches dictates the available internal volume. Verify that the enclosure series supports this specific backplate configuration and that the material meets necessary insulation standards.

Part Context

This backplate is part of the Hoffman Enclosures accessory portfolio, designed to enhance the functionality of their standard enclosure lines. It allows for secure attachment of internal hardware while maintaining electrical isolation from the enclosure structure itself.

Replacement Considerations

No public substitute part numbers are documented. Compatibility is limited to the specific enclosure models supported by the original manufacturer's design specifications.