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ACC43DRYN-S13 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Sullins Connector Solutions. Its product description is CONN EDGE DUAL FMALE 86POS 0.100. Review the specifications below when checking this part for your BOM.
The ACC43DRYN-S13 is an active dual-edge female card edge connector manufactured by Sullins Connector Solutions. It features 86 positions arranged in two rows of 43 contacts with a 0.100-inch (2.54mm) pitch. Designed for through-hole termination, the connector utilizes beryllium copper cantilever contacts with 30.0µin gold plating. The housing is green polyphenylene sulfide (PPS), rated for operation between -65°C and 150°C. It accommodates a board thickness of 0.062 inches and includes top-mounting flange openings.
Verify the specific suffix 'S13' against official Sullins documentation to confirm exact packaging and environmental compliance details. Ensure that the required board thickness matches the 0.062-inch specification. Confirm RoHS3 compliance status directly with the manufacturer prior to final procurement decisions.
Select this component when a dual-edge female interface with a 2.54mm pitch is required. The cantilever contact style offers flexibility during insertion. Verify that the application environment stays within the -65°C to 150°C operating range. Ensure PCB layout supports through-hole soldering and provides adequate clearance for the top-mounting flange openings.
This part belongs to the ACC43 series of card edge connectors from Sullins Connector Solutions. The series provides various configurations for dual-edge applications. The ACC43DRYN-S13 specifically denotes the dual-row, yellow/green color variant with standard spacing. It serves as a robust solution for connecting peripheral boards to main systems.
Direct substitutes include ACC43DEYH and FMC43DRYN. Note that ACC43DEYH uses different contact materials and may have distinct mechanical tolerances. FMC43DRYN features full bellows contacts rather than cantilever types. Verify compatibility with existing PCB footprints before substitution.
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