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ADS61B23IRHBR is listed in the Analog To Digital Converters (ADC) range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC ADC 12BIT PIPELINED 32VQFN. Review the specifications below when checking this part for your BOM.
The ADS61B23IRHBR is a 12-bit, 80 MSPS analog-to-digital converter (ADC) from Texas Instruments. It features buffered differential inputs and a pipeline architecture. The device operates on a 3.3 V analog supply and a 1.65 V to 3.6 V digital supply. Key performance metrics include a Signal-to-Noise Ratio (SNR) of 70.2 dB, an Effective Number of Bits (ENOB) of 11.3 bits, and a power dissipation of 475 mW. It utilizes LVDS parallel output interfaces and is housed in a 32-VQFN package.
Verify the specific suffix 'RHBR' corresponds to the tape-and-reel packaging configuration required for automated assembly processes. Confirm that the operating temperature range meets the environmental specifications of the target application. Ensure compatibility with the 3.3 V analog and variable digital supply voltages during system design validation.
Select this component when a single-channel, high-speed digitization solution is required with minimal external analog circuitry. The integrated buffers simplify layout by reducing sensitivity to trace impedance mismatches. Consider the 12-bit resolution and 80 MSPS rate against higher-speed or multi-channel alternatives if bandwidth or channel count requirements exceed these specifications.
This part belongs to the ADS61B23 family of high-performance ADCs. It shares the core pipeline architecture and pinout with variants like the ADS61B23IRHBT, differing primarily in packaging and reel specifications. The series is designed for applications demanding low power consumption alongside high dynamic range performance in a compact form factor.
The ADS61B23IRHBT is a confirmed substitute within the same family, offering identical electrical characteristics but potentially differing in reel quantity or specific packaging handling requirements. Verify package dimensions and thermal pad connectivity remain compatible with the existing PCB footprint before substitution.
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